As governments go digital, the demand for contactless chips for use in electronic documents is expected to grow in the next five years to as much as $1 billion annually, and Texas Instruments (TI) wants a piece of that market. The Dallas company said last month that it is developing a new smart, integrated-circuit design that features a memory technology optimized for radio frequency readers. The State Department began issuing e-passports with embedded contactless chips in August 2006 and switched completely to the new format in May. The passports contain not only traditional printed information but also electronic data than can be accessed with RF readers. TI is eyeing the next generation of passports for its chips.
(Government Computer News story)
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